Head of Power Packaging & SiC/GaN Technology
renesasAustin, TX
Head of Power Packaging & SiC/GaN Technology
renesasAustin, TX
yesterday
Industries
Semiconductor and Related Device ManufacturingOther Electronic Component ManufacturingElectronic Connector ManufacturingAbout the role
Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification. The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.
Matching similar jobs
JOB OVERVIEW
Experience level
Manager
Location
Austin, TX
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday
Tired of running searches?
Rank the roles you'd take once, and matches like these arrive on their own.
CREATE PROFILE