Application Engineer

Location: Chandler, Arizona – Onsite

Salary: $90,000–$105,000 + 5% bonus + benefits

Travel: Approx. 25–30%We are supporting a specialist semiconductor equipment manufacturer looking to hire an Applications Process Engineer for its facility in Chandler, AZ.The key requirement is hands-on semiconductor industry experience. You could currently be working as a Process Engineer, Equipment Engineer, Maintenance Engineer, Field Service Engineer, Applications Engineer or Manufacturing Engineer – you do not need previous Applications experience. The role will involve working with high-precision die bonding and advanced packagingequipment, supporting customers with: Process development and optimization Equipment setup, trials and demonstrations Technical troubleshooting and root-cause analysis Installation and qualification Customer training and technical support You'll work across applications including advanced packaging, photonics, MEMS, sensors and quantum computing, with full training provided on the company's equipment. Experience with die attach, die bonding, wire bonding, flip-chip or advanced packaging would be beneficial, but we're equally interested in strong semiconductor engineers with hands-on equipment and process experience. This is an excellent opportunity for someone looking to move into a more varied, technical and customer-facing position within the semiconductor industry.