Chemical Mechanical Polishing (CMP) Staff Engineer

Responsibilities: Equipment and material characterization as it relates to CMP. Drive continuous improvement of CMP process capability and controls. Complex CMP process integration for CMOS/MEMS/Superconducting/Photonics or other novel device types. Resolve process excursions and drive permanent Root Cause Corrective Actions (RCCA).

Education: Bachelors & Masters in an Engineering discipline, or PhD in an Engineering discipline. BS with 5 years, MS with 3 years, or PhD with 0-3 years of engineering experience in a semiconductor fab or lab environment. Fab processing tools knowledge/experience, particularly with CMP processing knowledge/experience. CMOS/MEMS/Photonic device and integration knowledge with relevant combination of years of experience and/or advanced degree. Knowledge of DOE, SPC, and 6-sigma concepts and applications. Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes. Can work both independently and in cross-functional teams for problem solving. US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.