Principal Thermal Architect — AI Compute & Packaging
qualcommSan Diego, CA
Principal Thermal Architect — AI Compute & Packaging
qualcommSan Diego, CA
yesterday
Industries
Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment ManufacturingElectronic Computer ManufacturingHeating Equipment (except Warm Air Furnaces) ManufacturingAbout the role
Qualcomm Technologies, Inc. is seeking a Principal Thermal Engineer to solve complex thermal challenges and enable leading performance for the Dragonfly AI300 platform and future AI computing platforms.
You will work on cutting-edge thermal architecture, simulation, validation, and optimization with cross-functional teams across silicon, packaging, hardware, and system engineering. You will lead thermal design reviews, perform CFD analyses, and communicate results to stakeholders, driving
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JOB OVERVIEW
Experience level
Lead
Location
San Diego, CA
Occupation
Mechanical Engineers
Industry
Air-Conditioning and Warm Air Heating Equipment and Commercial and Industrial Refrigeration Equipment Manufacturing
Posted
yesterday
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