Senior Electro Optics Packaging Engineer

What You’ll Do: Lead mechanical and opto‑mechanical design of compact, high‑performance EO modules Architect packaging solutions for optoelectronic and IC assemblies (fiber alignment, wire bonding, flip‑chip, 3D packaging)Perform structural, thermal, and coupled‑physics simulations using ANSYS, COMSOL, and Solid Works Ensure micro‑radian alignment stability under dynamic thermal, shock, and vibration environments Conduct material property analysis, yield improvement, and failure‑mode investigations Collaborate with photonics, electronics, reliability, and manufacturing teams to deliver production‑ready hardware Ensure compliance with JEDEC, EIA, Telcordia, and MIL‑STD requirements What You Bring 10+ yearsin optical, optoelectronic, or IC packaging and assembly Expertise in optical bench design and precision alignment systems Hands‑on experience with fiber alignment tools, wire bonding, flip‑chip bonding, and fiber packaging Strong background in microelectronics, optoelectronics packaging, and low‑outgassing adhesive systems Proficiency with Solid Works and FEA tools (ANSYS required)Knowledge of materials, multilayer interfaces, BGA/PCBA/Flex reliability, and 3D packaging Familiarity with DOE, SPC, Six Sigma, and reliability engineering methodologiesU.S. Citizenship or Permanent Residency(ITAR‑restricted programs)EducationBS in Mechanical Engineering, Electrical Engineering, Physics, Applied Physics, or related fieldMS or PhD preferred Why APICWork on breakthrough photonic‑enabled compute architectures Contribute to dual‑use technologies with national‑security impact Competitive compensation and comprehensive benefits Los Angeles, CA • $115,000.00 - $130,000.00