Director, IC Packaging Engineering – Mechanical Simulation

Minimum Qualifications: Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ years of System/Package Design/Technology Engineering or related work experience. Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 7+ years of System/Package Design/Technology Engineering or related work experience. PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.

Preferred Qualifications: Ph. D. in Mechanical Engineering, Materials Science, Electrical/Microelectronics Engineering, or related field. 12+ years of combined experience in finite element modeling and analysis for IC electronic packaging and interconnects. 5+ years of direct people management, with experience managing managers or senior technical staff. Proven track record of building and scaling high-performing simulation or engineering teams. Deep expertise in IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, package-board interaction, and DOE. Strong background in electronic packaging materials and thermo-mechanical behavior. Experience establishing simulation BKMs, methodologies, and automation frameworks (e.g., APDL macros, OptiSLang, scripting/automation pipelines). Experience with material testing for strength and fracture, including designing and executing mechanical test methods. Demonstrated experience presenting technical roadmaps and simulation strategies to executive and customer audiences. Publications or patents in FEA predictive modeling, warpage/SJR, and/or interfacial fracture testing (plus). Experience working with external customers or partners in a technical liaison or program leadership capacity. Excellent communication, influencing, and cross-functional collaboration skills. Ability to manage competing priorities across multiple programs and business units. Demonstrated ability to lead cross-functional technical programs and influence at senior levels. Pay Range and Benefits$227,300.00 - $340,900.00. The company also offers a competitive annual discretionary bonus program and opportunities for annual RSU grants.

EEO Statement: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.