About the role

Job Description: Lead complete RF/microwave and high-speed mixed-signal hardware architecture for next-generation optical transceivers, evaluation boards, reference platforms, and production test hardware. Design high-speed schematics and PCBAs for 100G/lane, 200G/lane, 400G/lane and beyond interconnects, supporting 800G, 1.6T, 3.2T and future architectures where applicable. Own board-level tradeoffs for signal integrity, power integrity, EMI/EMC, grounding, return path control, isolation, thermal performance, manufacturability, serviceability, cost, reliability, and schedule. Architect and design high-performance instrumentation used for validation, characterization, calibration, automation, manufacturing test, and sustaining support of fiber optic transceiver modules. Select and qualify high-speed, RF, microwave, analog, precision measurement, clocking, DSP, control, sensing, connector, cable, interconnect, and power components. Define PCB stackups, materials, copper weights, dielectric selection, via structures, backdrill strategy, impedance targets, loss budgets, fabrication rules, assembly constraints, and acceptance criteria. Partner with SI/PI, packaging, optics, firmware, software, mechanical, thermal, reliability, manufacturing, supply chain, and operations teams to deliver complete product and test solutions. Lead schematic capture, layout strategy, layout review, RF structure review, BOM review, DFM/DFT review, design verification, bring-up, debug, characterization, and production release. Define digital control interfaces and hardware/firmware interaction

Matching similar jobs

JOB OVERVIEW

Experience level

Manager

Location

Saxonburg, PA

Occupation

Electronics Engineers, Except Computer

Industry

Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing

Posted

yesterday

Tired of running searches?

Rank the roles you'd take once, and matches like these arrive on their own.

CREATE PROFILE