Senior Substrate Design & Process Integration Leader

AMD in Austin, Texas seeks a technical leader to shape next‐generation substrate architecture, design rules, and technology platforms for future packaging. You will work with package architects, substrate designers, silicon teams, and suppliers to co‐optimize substrate solutions for performance, yield, reliability and cost. The ideal candidate has deep expertise in substrate design, process integration, and design‐for‐manufacturability, translating product needs into scalable substrate