About the role

Key Responsibilities: **SMT Line Setup & Operation Execute complete line setups and changeovers, including solder paste printers, pick-and-place machines (e.g., Yamaha, Fuji, Juki, ASM, or equivalent), and reflow ovens. Load, verify, and validate feeders according to setup sheets and BOM requirements. Confirm correct component polarity, orientation, and package types. Validate machine programs and placement accuracy. Perform and inspect first-article builds to ensure compliance before full production runs. Process Control & Optimization Inspect solder paste deposition and fine-tune print parameters (alignment, pressure, speed) as needed. Monitor for common placement defects such as tombstoning, skew, insufficient solder, and bridging. Review and verify reflow oven profiles and thermal parameters. Identify root causes of placement and soldering defects and implement corrective actions. Make minor equipment adjustments to optimize quality, minimize downtime, and support ongoing yield improvement efforts. Quality & Documentation Conduct in-process inspections in accordance with IPC-A-610 standards. Maintain lot traceability and proper material handling controls. Document nonconformances, root causes, and resolutions; escalate issues promptly when required. Adhere to ESD protocols and safe component handling practices. Accurately record production data in ERP/MES systems. Maintenance & Troubleshooting Perform routine preventive maintenance on SMT equipment. Replace nozzles, clean stencils, and resolve placement errors or jams. Troubleshoot feeder malfunctions, vision system faults, pick errors, and related issues. Partner with engineering teams on program refinements and process enhancements.
Required Qualifications: Minimum 3+ years of direct SMT line operation experience in a production setting. Hands-on experience with multi-head pick-and-place systems, fine-pitch components, and BGA placement. Proficiency placing 0201 (or smaller) components (strongly preferred).Ability to read and interpret BOMs, assembly drawings, setup sheets, and work instructions. Expertise in feeder setup, verification, and quick changeover techniques. In-depth knowledge of common SMT defects, their causes, and corrective/preventive measures. Comfort thriving in a fast-paced, high-mix/low-volume manufacturing environment.
Preferred Qualifications: Current IPC-A-610 certification. Familiarity with IPC-J-STD-001 soldering standards. Experience operating AOI (Automated Optical Inspection) systems. Knowledge of reflow profiling techniques. Background in contract/EMS (electronics manufacturing services) environments. Exposure to Lean manufacturing principles, 5S, or continuous improvement methodologies.
Technical Competencies: Solder paste printing optimization and defect analysis. Pick-and-place machine calibration, alignment, and program validation. Reflow process fundamentals and profile management. Accurate component package identification and handling. ESD prevention and compliance. Strong process troubleshooting and root-cause analysis skills.
Physical Requirements: Ability to stand for prolonged periods. Capable of lifting up to 30 lbs. Comfortable working in a production manufacturing facility.

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JOB OVERVIEW

Experience level

Senior

Location

West Melbourne, FL

Occupation

Semiconductor Processing Technicians

Industry

Printed Circuit Assembly (Electronic Assembly) Manufacturing

Posted

2 days ago

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