Senior Process Engineer - Flip-Chip Packaging (Remote)

Lumicity partners with a leading semiconductor company to hire a Senior Process Engineer who will lead hands-on development of advanced packaging processes for flip-chip technology, from early development to qualification and high-volume manufacturing, with global team collaboration. The role offers remote work in the USA, a base salary of $220,000–$270,000 plus performance bonus and RSUs, and full-time permanent employment, with opportunities to own critical process improvements in copper