About the role

Job Title: Senior Process Integration Engineer - Power Device
Job Location: Hillsboro, OR
Compensation: $110K - $160K base DOE
Requirements: Process Integration, Power Devices (MOSFET/IGBT), Device Characterization, Wafer Fabrication, New Product Introduction (NPI), Yield Improvement
Position Overview: We are seeking a highly skilled Process Integration Engineer specializing in Silicon Devices to join our team. The successful candidate will be responsible for developing and optimizing integration processes for silicon-based power devices, including MOSFETs and IGBTs, with a strong focus on yield improvement and device performance.
Key Responsibilities: Develop and optimize process integration for silicon power devices such as MOSFETs and IGBTs. Collaborate with design and manufacturing teams to ensure seamless integration of new processes into production. Conduct experiments to evaluate and improve device performance and yield. Analyze process data to identify trends and areas for improvement. Provide technical support for production issues related to device processing and integration.
Qualifications: Master's degree (PhD Preferred) in Electrical Engineering or a related field. Proven experience in process integration for silicon power devices. Strong understanding of power device technologies, specifically MOSFETs and IGBTs. Experience in yield improvement methodologies and device processing techniques. Excellent problem-solving skills and ability to work in a team-oriented environment.
Benefits: Vacation/PTOMedical/Dental/Vision 401KSign-On Bonus Relocation Assistance

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JOB OVERVIEW

Salary

$110 K - $160 K

Experience level

Lead

Location

Hillsboro, IL

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

2 days ago

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