Hardware Intern: Soldering & Packaging Research
ibmYorktown Heights, NY
yesterday
Occupations
Computer Hardware EngineersWelders, Cutters, Solderers, and BrazersComputer and Information Research ScientistsIndustries
Electronic Computer ManufacturingPrinted Circuit Assembly (Electronic Assembly) ManufacturingComputer Terminal and Other Computer Peripheral Equipment ManufacturingAbout the role
IBM Research invites applications for Hardware Intern 2027: Advanced Solder Processes, Yorktown Heights, NY. This internship focuses on studying bonding and reflow techniques with relevance to high-performance computing.
Ideal candidates have a High School Diploma or GED, with preferred Bachelor's degree and strong SMT soldering knowledge. The role emphasizes teamwork, data analysis, and a drive to learn new soldering innovations.
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JOB OVERVIEW
Experience level
Intern
Location
Yorktown Heights, NY
Occupation
Computer Hardware Engineers
Industry
Electronic Computer Manufacturing
Posted
yesterday
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