Head of Power Packaging & SiC/GaN Technology

renesas electronicsAustin, TX

yesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Natural Sciences Managers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Electronic Connector Manufacturing

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About the role

Renesas Electronics Corp. is seeking an senior-level professional to lead Package Technology Development/NPI, R&D, and Global OSAT management for new package development and product qualification. The role supports technology roadmaps and budgets while driving customer adoption programs. You will focus on design and development of package and interconnect methods for AI/datacenter infrastructure power packaging, including Smart Power Stages, Vertical Power Stages, Power Modules & Discrete FETs.

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JOB OVERVIEW

Experience level

Manager

Location

Austin, TX

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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