Advanced Packaging Process Engineer: High-Impact
intelChandler, AZ
Advanced Packaging Process Engineer: High-Impact
intelChandler, AZ
yesterday
Occupations
Packaging and Filling Machine Operators and TendersPackers and Packagers, HandManufacturing EngineersIndustries
Semiconductor Machinery ManufacturingElectronic Computer ManufacturingSemiconductor and Related Device ManufacturingAbout the role
Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, Arizona seeks a Packaging Module Development Engineer to advance packaging processes, drive optimization, and qualification for high‑volume production.
You will design and execute experiments using SPC and DOE, collaborate with cross‑functional engineering, manufacturing, and product teams, and contribute to reliable, cost‑effective packaging solutions that scale globally.
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JOB OVERVIEW
Experience level
Senior
Location
Chandler, AZ
Occupation
Packaging and Filling Machine Operators and Tenders
Industry
Semiconductor Machinery Manufacturing
Posted
yesterday
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