Senior Power Packaging Design Engineer (NPI & OSAT)

renesas electronicsPhoenix, AZ

yesterday

Occupations

Electronics Engineers, Except Computer Electrical Engineers Computer Hardware Engineers

Industries

Semiconductor and Related Device Manufacturing Other Electronic Component Manufacturing Printed Circuit Assembly (Electronic Assembly) Manufacturing

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About the role

Renesas Electronics Corp. in Phoenix, AZ seeks a senior packaging technologist to lead development for AI/datacenter power packaging and advanced interconnects, including SiC/GaN considerations. You will manage OSAT/CM partners, drive DOE studies, and qualify new packages within aggressive timelines. Candidate should have 15–20 years in power package development, strong wafer-level/flip-chip expertise, and excellent analytical and presentation skills.

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JOB OVERVIEW

Experience level

Senior

Location

Phoenix, AZ

Occupation

Electronics Engineers, Except Computer

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

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