Lead 2.5D/3D Advanced Packaging Engineer

Broadcom, Inc. is seeking a senior packaging leader to drive 2.5D/3D advanced packaging architectures in collaboration with silicon, package design, and marketing teams. You will lead cross-functional efforts with external assembly and memory partners to meet stringent requirements. The role requires a PhD or Master's in engineering and 10+ years of packaging experience, including substrates/interposers and wafer-level approaches. Travel may be required.