Lead HBM Memory Architect for Next-Gen AI/ML

Micron Technology in Richardson, Texas, seeks a Principal HBM Design Architect to design, simulate, optimize, and floorplan advanced DRAM circuits for next-generation High Bandwidth Memory products. You will collaborate with global teams across digital, analog, and mixed-signal domains to ensure performance and power efficiency. The role involves pathfinding for new architectures, design reviews, and driving continuous improvement of design methodologies, with on-site work in Richardson, TX.