Senior Thin-Film Architect, Advanced Packaging

Micron Technology, Inc. in Boise, Idaho is seeking a Principal Thin Films Engineer for Advanced Packaging. You will lead development and optimization of thin film deposition processes for next-generation memory products, taking ideas from concept through pilot to production. The role requires deep SME in thin films and 7+ years in Advanced Packaging, with data analysis/DOE and collaboration across process integration, failure analysis, yield, and equipment vendors. Some travel may be required.