Staff Foundry Technology Reliability Engineer – HBM | Micron Technology | Folsom

nanohelpFolsom, CA

yesterday

$114,000 per year

APPLY NOW

About the role

Staff Foundry Technology Reliability Engineer – HBM | Micron Technology | Folsom Micron Technology’s Heterogeneous Integration Group (HIG) is leading the development of High Bandwidth Memory (HBM)for AI and ML applications — a breakthrough in semiconductor miniaturization. Leveraging Through Silicon Via (TSV)technology, the team stacks DRAM dies and logic in a single package, achieving unmatched memory density and speed. This role focuses onnano-enabled reliability engineeringto push the limits of advanced FinFETandTSV-based architectures. Lead reliability engineering for cutting-edgeHBM productsat Micron Technology, Folsom. Collaborate across design, foundry, and R&D teams to assess, model, and optimize nanotechnology-enabled process reliability for FinFET nodesandTSV interconnects.
Responsibilities: Define, assess, and optimize reliability specifications for advanced FinFET-based base diesand TSV interconnect structures. PerformTMI_Aging simulationsfor both digital and custom flows, evaluate degradation due toBTI, HCI, SHE, TDDB, and setelectromigration limitsfor TSV chains.
Requirements: BS in EE/CS or related + 3+ years relevant experience Foundry PDKs, CMOS design, EDA tools, reliability simulations Micron’s HIG team is pushing the frontiers ofheterogeneous integration, delivering high-performance High Bandwidth Memory (HBM)solutions for AI/ML workloads that demand extreme memory bandwidth. This is not just incremental semiconductor work — it’s deepnanotechnology-enabled packaging, usingTSVto vertically integrate multiple dies for minimal latency and maximum throughput.
What We Offer: Competitive salary + bonus + stock options
Salary range: $114,000 – $280,000 USD Micron is an equal opportunities employer and welcomes applications from all qualified candidates. We are committed to a diverse and inclusive workplace.

Matching similar jobs

JOB OVERVIEW

Salary

$114,000 per year

Experience level

Lead

Location

Folsom, CA

Occupation

Microsystems Engineers

Industry

Semiconductor and Related Device Manufacturing

Posted

yesterday

Tired of running searches?

Rank the roles you'd take once, and matches like these arrive on their own.

CREATE PROFILE