Senior 3D Packaging & Thermal Modeling Engineer

GlobalFoundries seeks an experienced mechanical, thermal or electrical modeler/engineer to address 3DHI and advanced packaging questions across logic, RF, analog and memory technologies. You will use commercial modeling tools to guide device integration and 3DHI optimizations for mechanical, thermal or electrical performance. The role is based in our state-of-the-art 300mm Malta, New York fabrication facility, with emphasis on simulations to drive design decisions and enable robust device