Principal Packaging Engineer — Power & High-Density
nxp semiconductors nvChandler, AZ
Principal Packaging Engineer — Power & High-Density
nxp semiconductors nvChandler, AZ
yesterday
Occupations
Electronics Engineers, Except ComputerComputer Hardware EngineersPackers and Packagers, HandIndustries
Semiconductor and Related Device ManufacturingSemiconductor Machinery ManufacturingOther Electronic Component ManufacturingAbout the role
NXP Semiconductors NV in Chandler, AZ is seeking a Senior Semiconductor Packaging Engineer to lead package development for new products and technologies across business lines. You will define architectures, materials, structures, and assembly processes to meet reliability, performance, manufacturability, and cost targets.
You will drive cross-functional programs with Marketing, Design, Product Engineering, and external partners, monitor advances in PLP and power packaging, and support NPI/NTI
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JOB OVERVIEW
Experience level
Lead
Location
Chandler, AZ
Occupation
Electronics Engineers, Except Computer
Industry
Semiconductor and Related Device Manufacturing
Posted
yesterday
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