Hybrid OPC R&D Engineer: Patterning & Tapeout Lead

Solidigm is seeking a Lead OPC R&D Engineer to develop and guide high-quality patterning solutions for memory devices. You will model and correct optical effects, drive SMO and DFM techniques, and ensure the final layout transfers accurately to wafers while meeting manufacturing requirements. In this hybrid US-based role, you will collaborate with design, TD, lithography, and manufacturing teams, mentor colleagues, and contribute to documenting processes and training internal teams.