RF Chiplet Design Engineer - Heterogeneous Integration

imec USA's Kissimmee, Florida R&D Center is advancing RF heterogeneous integration technologies for ultra-high-frequency applications. You will co-design and simulate CMOS and III-V devices on silicon interposers, balancing performance with manufacturability. You will work with a multidisciplinary team across the US and Belgium, developing building blocks, performing tapeouts, and contributing to technical publications and prototypes for real-world applications.