Senior Signal Integrity Engineer - AI Chip & 3D Packaging

Arm is seeking a Staff Signal Integrity Engineer in the United States to lead SI design, modeling, and validation for AI superchip and data center platforms. You will work across silicon, advanced packaging, and system interconnects to ensure robust electrical performance. The role requires 8+ years in high-speed SI, expertise with 3D EM tools such as HFSS, SIwave, and ADS, and a track record in DDR/LPDDR, PCIe/CXL, and SerDes interfaces.