Senior Flip-Chip Packaging Engineer, 2.5D/3D

Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross-functional support for package and system productization. Responsibilities include developing attach processes, defining bump stacks, enabling die-to-substrate integration, and mitigating risks such as warpage and voiding.